DM-X Series 3D Camera
Industrial high-precision 3D camera (X86 computing platform)
Based on Sony DepthSense® technology, DM-X is a high-performance 3D RGBD industrial camera, with millimeter precision, VGA Depth Resolution. Embedded unique algorithms in product, the product can provide IR, point cloud, depth and RGB information in real time. Equipped with high-performance Intel CPU, the product supports embedded algorithm deployment and can be widely used in long-distance non-contact measurement, crowd count, industrial automation, logistics, and robotics.
Features
Support AI Algorithm Deployment (X86)
Millimeter Precision
Anti-interference Ambient Light
Sony DepthSense® Technology
SDK Supports Multiple Platforms
Multi-mode Operation
| Product Number | LWP-D311C-I | LWP-D311C-I/F |
| Dimensions | 130mm x 55mm x 75mm | 130mm x 78mm x 75mm |
| Working Principle | ToF（Time-of-Flight）depth camera | |
| Laser | 940nm VCSEL*2 | |
| Working Distance | 0.2m~5m | |
| Ranging Accuracy | ＜1% | |
| Field of View （H x V） | 70° x 50° | |
| Resolution (RGB) | 1600×1200 dpi | |
| Resolution (ToF) | 640 x 480 dpi | |
| Frame Rate | 20fps | |
| Operating Temperature | -30℃ ~ 65℃ | |
| Storage Temperature | -40℃ ~ 85℃ | |
| Power Consumption | ＜10w | |
| I/O Interface | 1 input, 1 output，1 I/O | |
| Data Interface | RJ45 *1，HDMI*1，built-in USB*1，ExternalUSB*2 | |
| Power Supply | DC12V/24V | |
| CPU | N97（2.0GHz） | |
| RAM | 8G | |
| Disk | 64G/128G | |
| Operating System | Default Win11 64 bit system | |
| Protection Level | IP42 | |
| Eye Safety | Class1 | |
